Part Details for UPD44644362AF5-E33-FQ1-A by Renesas Electronics Corporation
Overview of UPD44644362AF5-E33-FQ1-A by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Renewable Energy
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EV-SOMCRR-EZLITE | Analog Devices | Compact DSP SOM Carrier Evalua | |
| EV-21562-AUTO | Analog Devices | ADSP-21562 Audio Weaver Eval B | |
| ADSP-CM409CBCZAFRL | Analog Devices | ARM Cortex M4 Mixed-Signal BGA |
Part Details for UPD44644362AF5-E33-FQ1-A
UPD44644362AF5-E33-FQ1-A CAD Models
UPD44644362AF5-E33-FQ1-A Part Data Attributes
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UPD44644362AF5-E33-FQ1-A
Renesas Electronics Corporation
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Datasheet
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UPD44644362AF5-E33-FQ1-A
Renesas Electronics Corporation
2MX36 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.46 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.64 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for UPD44644362AF5-E33-FQ1-A
This table gives cross-reference parts and alternative options found for UPD44644362AF5-E33-FQ1-A. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD44644362AF5-E33-FQ1-A, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8662R36BGD-300T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | UPD44644362AF5-E33-FQ1-A vs GS8662R36BGD-300T |
| K7I643682M-FC30T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | UPD44644362AF5-E33-FQ1-A vs K7I643682M-FC30T |
| GS8672T36BE-300 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | UPD44644362AF5-E33-FQ1-A vs GS8672T36BE-300 |
| CY7C1520KV18-300BZC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | UPD44644362AF5-E33-FQ1-A vs CY7C1520KV18-300BZC |
| K7I643682M-EC30T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | UPD44644362AF5-E33-FQ1-A vs K7I643682M-EC30T |
| CY7C1520KV18-300BZXC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | UPD44644362AF5-E33-FQ1-A vs CY7C1520KV18-300BZXC |
| CY7C1570V18-300BZXC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | UPD44644362AF5-E33-FQ1-A vs CY7C1570V18-300BZXC |
| CY7C1520AV18-300BZXC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | UPD44644362AF5-E33-FQ1-A vs CY7C1520AV18-300BZXC |
| CY7C1520V18-300BZC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | UPD44644362AF5-E33-FQ1-A vs CY7C1520V18-300BZC |
| GS8662R36BD-300 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | UPD44644362AF5-E33-FQ1-A vs GS8662R36BD-300 |