Part Details for UPD703100AF1-40-FA1 by NEC Electronics Group
Overview of UPD703100AF1-40-FA1 by NEC Electronics Group
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for UPD703100AF1-40-FA1
UPD703100AF1-40-FA1 CAD Models
UPD703100AF1-40-FA1 Part Data Attributes
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UPD703100AF1-40-FA1
NEC Electronics Group
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UPD703100AF1-40-FA1
NEC Electronics Group
Microcontroller, 32-Bit, MROM, MOS, PBGA157, 14 X 14 MM, PLASTIC, FBGA-157
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NEC ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | LFBGA, | |
Pin Count | 157 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 40 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PBGA-B157 | |
Length | 14 mm | |
Number of I/O Lines | 123 | |
Number of Terminals | 157 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
ROM Programmability | MROM | |
Seated Height-Max | 1.46 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | MOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |