Part Details for UPD75P116GB-XXX3BS-MTX by Renesas Electronics Corporation
Overview of UPD75P116GB-XXX3BS-MTX by Renesas Electronics Corporation
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for UPD75P116GB-XXX3BS-MTX
UPD75P116GB-XXX3BS-MTX CAD Models
UPD75P116GB-XXX3BS-MTX Part Data Attributes:
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UPD75P116GB-XXX3BS-MTX
Renesas Electronics Corporation
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UPD75P116GB-XXX3BS-MTX
Renesas Electronics Corporation
IC,MICROCONTROLLER,4-BIT,UPD75XL CPU,CMOS,QFP,44PIN,PLASTIC
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Package Description | QFP, QFP44,.5SQ,32 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 4 | |
| CPU Family | UPD75XL | |
| JESD-30 Code | S-PQFP-G44 | |
| JESD-609 Code | e0 | |
| Number of Terminals | 44 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP44,.5SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 256 | |
| ROM (words) | 16384 | |
| ROM Programmability | UVPROM | |
| Speed | 0.5 MHz | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD |