Part Details for UPD78F0890GB(A2)-GAH-AX by NEC Electronics America Inc
Overview of UPD78F0890GB(A2)-GAH-AX by NEC Electronics America Inc
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Consumer Electronics
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Part Details for UPD78F0890GB(A2)-GAH-AX
UPD78F0890GB(A2)-GAH-AX CAD Models
UPD78F0890GB(A2)-GAH-AX Part Data Attributes:
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UPD78F0890GB(A2)-GAH-AX
NEC Electronics America Inc
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UPD78F0890GB(A2)-GAH-AX
NEC Electronics America Inc
Microcontroller, 8-Bit, FLASH, 20MHz, CMOS, PQFP64, 10 X 10 MM, LEAD FREE, PLASTIC, LQFP-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NEC ELECTRONICS AMERICA INC | |
| Package Description | 10 X 10 MM, LEAD FREE, PLASTIC, LQFP-64 | |
| Reach Compliance Code | compliant | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 8 | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G64 | |
| JESD-609 Code | e6/e4 | |
| Length | 10 mm | |
| Number of I/O Lines | 55 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 20 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN BISMUTH/NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |