Part Details for VB125ASP by STMicroelectronics
Results Overview of VB125ASP by STMicroelectronics
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VB125ASP Information
VB125ASP by STMicroelectronics is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
US Tariff Estimator: VB125ASP by STMicroelectronics
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VB125ASP Part Data Attributes
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VB125ASP
STMicroelectronics
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Datasheet
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VB125ASP
STMicroelectronics
Buffer/Inverter Based Peripheral Driver, 1 Driver, 8.8A, PDSO10
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | SOIC | |
| Package Description | Sop-10 | |
| Pin Count | 10 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.60 | |
| Built-in Protections | Transient | |
| Driver Number of Bits | 1 | |
| Interface IC Type | Buffer Or Inverter Based Peripheral Driver | |
| JESD-30 Code | R-PDSO-G10 | |
| JESD-609 Code | e3 | |
| Length | 9.4 Mm | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current Flow Direction | Source | |
| Output Peak Current Limit-Nom | 8.8 A | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | HSOP | |
| Package Equivalence Code | SOP10,.55 | |
| Package Shape | Rectangular | |
| Package Style | Small Outline, Heat Sink/Slug | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.75 Mm | |
| Supply Current-Max | 300 Ma | |
| Supply Voltage-Max | 24 V | |
| Supply Voltage-Min | 6 V | |
| Supply Voltage-Nom | 14 V | |
| Surface Mount | Yes | |
| Temperature Grade | Automotive | |
| Terminal Finish | Matte Tin | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 1.27 Mm | |
| Terminal Position | Dual | |
| Turn-off Time | 60 µS | |
| Width | 7.5 Mm |
VB125ASP Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN4392, which includes guidelines for thermal pad connection, copper pour, and via placement to ensure optimal thermal performance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal pads or thermal grease, to improve heat dissipation.
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Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, which is higher than the recommended VCC voltage. However, exceeding this voltage may cause damage to the device.
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The VB125ASP has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, such as wrist straps, mats, and bags, and ensure that the device is properly grounded during handling.
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STMicroelectronics recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. It's essential to follow this profile to prevent damage to the device during the soldering process.