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Overview of W24L257Q70LE by Winbond Electronics Corp
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for W24L257Q70LE by Winbond Electronics Corp
Part Data Attributes for W24L257Q70LE by Winbond Electronics Corp
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
Part Package Code
|
TSOP
|
Package Description
|
TSOP1, TSSOP28,.53,22
|
Pin Count
|
28
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
70 ns
|
Additional Feature
|
ALSO OPERATES WITH 5V SUPPLY
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDSO-G28
|
JESD-609 Code
|
e0
|
Length
|
11.8 mm
|
Memory Density
|
262144 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
28
|
Number of Words
|
32768 words
|
Number of Words Code
|
32000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-20 °C
|
Organization
|
32KX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSOP1
|
Package Equivalence Code
|
TSSOP28,.53,22
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Standby Voltage-Min
|
2 V
|
Supply Current-Max
|
0.07 mA
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
DUAL
|
Width
|
8 mm
|