Part Details for W2Z1M72SJ28BC by White Electronic Designs Corp
Overview of W2Z1M72SJ28BC by White Electronic Designs Corp
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for W2Z1M72SJ28BC
W2Z1M72SJ28BC CAD Models
W2Z1M72SJ28BC Part Data Attributes
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W2Z1M72SJ28BC
White Electronic Designs Corp
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Datasheet
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W2Z1M72SJ28BC
White Electronic Designs Corp
SRAM Module, 1MX72, 2.8ns, CMOS, PBGA209, PLASTIC, BGA-209
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | PLASTIC, BGA-209 | |
Reach Compliance Code | unknown | |
Access Time-Max | 2.8 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B209 | |
Length | 22 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 72 | |
Number of Functions | 1 | |
Number of Terminals | 209 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX72 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.5 mm | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |
Alternate Parts for W2Z1M72SJ28BC
This table gives cross-reference parts and alternative options found for W2Z1M72SJ28BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W2Z1M72SJ28BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS864272GC-200I | Cache SRAM, 1MX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS864272GC-200I |
GS8644V72C-200T | Cache SRAM, 1MX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS8644V72C-200T |
GS864472C-200T | Cache SRAM, 1MX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS864472C-200T |
GS8644V72C-200 | Cache SRAM, 1MX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS8644V72C-200 |
GS8644V72GC-200IT | Cache SRAM, 1MX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS8644V72GC-200IT |
CY7C1474V33-200BGXC | ZBT SRAM, 1MX72, 3ns, CMOS, PBGA209, 14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209 | Cypress Semiconductor | W2Z1M72SJ28BC vs CY7C1474V33-200BGXC |
CY7C1487V25-133BGXC | Cache SRAM, 1MX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209 | Cypress Semiconductor | W2Z1M72SJ28BC vs CY7C1487V25-133BGXC |
GS8642Z72C-167IVT | ZBT SRAM, 1MX72, 8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS8642Z72C-167IVT |
GS8642V72GC-300IT | Cache SRAM, 1MX72, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS8642V72GC-300IT |
GS8644Z72GC-225T | ZBT SRAM, 1MX72, 6.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | W2Z1M72SJ28BC vs GS8644Z72GC-225T |