Part Details for WED3C7410E16M-400BM by Microsemi Corporation
Overview of WED3C7410E16M-400BM by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WED3C7410E16M-400BM
WED3C7410E16M-400BM CAD Models
WED3C7410E16M-400BM Part Data Attributes
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WED3C7410E16M-400BM
Microsemi Corporation
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Datasheet
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WED3C7410E16M-400BM
Microsemi Corporation
400MHz, RISC PROCESSOR, CBGA225, 21 X 25 MM, CERAMIC, BGA-225
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP-PMG MICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | 21 X 25 MM, CERAMIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | R-CBGA-B225 | |
| Low Power Mode | NO | |
| Number of Terminals | 225 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Speed | 400 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for WED3C7410E16M-400BM
This table gives cross-reference parts and alternative options found for WED3C7410E16M-400BM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WED3C7410E16M-400BM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| KMC9328MXLVF15 | 32-BIT, 150MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, MAPBGA-225 | Freescale Semiconductor | WED3C7410E16M-400BM vs KMC9328MXLVF15 |
| MC9328MXLVF20 | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC | Freescale Semiconductor | WED3C7410E16M-400BM vs MC9328MXLVF20 |
| MC9328MXLVP20 | 32-BIT, 200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225 | Freescale Semiconductor | WED3C7410E16M-400BM vs MC9328MXLVP20 |
| MC9328MXSCVP10R2 | 32-BIT, 100MHz, MICROPROCESSOR, PBGA225, 13 X 13 MM, ROHS COMPLIANT, PLASTIC, MAPBGA-225 | Freescale Semiconductor | WED3C7410E16M-400BM vs MC9328MXSCVP10R2 |
| MCF5251VM140 | MICROPROCESSOR | NXP Semiconductors | WED3C7410E16M-400BM vs MCF5251VM140 |
| MC9328MXLDVP15 | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,225PIN,PLASTIC | Freescale Semiconductor | WED3C7410E16M-400BM vs MC9328MXLDVP15 |
| MC9328MXLDVP15R2 | 32-BIT, 150MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225 | Freescale Semiconductor | WED3C7410E16M-400BM vs MC9328MXLDVP15R2 |
| MC9328MXSVF10 | 32-BIT, 100MHz, MICROPROCESSOR, PBGA225, 13 X 13 MM, PLASTIC, BGA-225 | Freescale Semiconductor | WED3C7410E16M-400BM vs MC9328MXSVF10 |
| MC9328MXSVP10R2 | 32-BIT, 100MHz, MICROPROCESSOR, PBGA225 | NXP Semiconductors | WED3C7410E16M-400BM vs MC9328MXSVP10R2 |
| MC9328MXLDVF20 | 200MHz, RISC PROCESSOR, PBGA225, 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225 | Motorola Mobility LLC | WED3C7410E16M-400BM vs MC9328MXLDVF20 |