Part Details for XCZU3EG-1LSFVA625I by AMD Xilinx
Overview of XCZU3EG-1LSFVA625I by AMD Xilinx
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Applications
Financial Technology (Fintech)
Computing and Data Storage
Telecommunications
Communication and Networking
Part Details for XCZU3EG-1LSFVA625I
XCZU3EG-1LSFVA625I CAD Models
XCZU3EG-1LSFVA625I Part Data Attributes
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XCZU3EG-1LSFVA625I
AMD Xilinx
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Datasheet
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XCZU3EG-1LSFVA625I
AMD Xilinx
Microprocessor Circuit,
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Date Of Intro | 2018-03-09 | |
Bus Compatibility | CAN, I2C, SPI, UART | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B625 | |
JESD-609 Code | e1 | |
Length | 21 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 625 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA625,25X25,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Seated Height-Max | 3.43 mm | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |