Part Details for XCZU4EG-1SFVC784I by AMD Xilinx
Overview of XCZU4EG-1SFVC784I by AMD Xilinx
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Applications
Computing and Data Storage
Part Details for XCZU4EG-1SFVC784I
XCZU4EG-1SFVC784I CAD Models
XCZU4EG-1SFVC784I Part Data Attributes
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XCZU4EG-1SFVC784I
AMD Xilinx
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Datasheet
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XCZU4EG-1SFVC784I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA784, FLIPCHIP-784
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-784 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| JESD-30 Code | R-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 784 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |