Part Details for XE164FM72F80LRABKXUMA1 by Infineon Technologies AG
Overview of XE164FM72F80LRABKXUMA1 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Motor control systems
Price & Stock for XE164FM72F80LRABKXUMA1
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
18AC0700
|
Newark | Mcu, 16Bit, 80Mhz, Lqfp-100, Product Range:Xe166 Family Xe164Fm Series Microcontrollers, Device Core:C166, Data Bus Width:16 Bit, Operating Frequency Max:80Mhz, Program Memory Size:576Kb, No. Of Pins:100Pins, Ic Case/Package:Lqfp Rohs Compliant: Yes |Infineon XE164FM72F80LRABKXUMA1 Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 0 |
|
Buy Now |
Part Details for XE164FM72F80LRABKXUMA1
XE164FM72F80LRABKXUMA1 CAD Models
XE164FM72F80LRABKXUMA1 Part Data Attributes
|
XE164FM72F80LRABKXUMA1
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
XE164FM72F80LRABKXUMA1
Infineon Technologies AG
Microcontroller, 16-Bit, FLASH, 80MHz, CMOS, PQFP100, LQFP-100
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | HLFQFP, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 42 Weeks, 4 Days | |
Samacsys Manufacturer | Infineon | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
Clock Frequency-Max | 40 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G100 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 74 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HLFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
RAM (bytes) | 32768 | |
ROM (words) | 589824 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.6 mm | |
Speed | 80 MHz | |
Supply Voltage-Max | 1.6 V | |
Supply Voltage-Min | 1.5 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |