Part Details for XOMAPL138ZWT by Texas Instruments
Results Overview of XOMAPL138ZWT by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XOMAPL138ZWT Information
XOMAPL138ZWT by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XOMAPL138ZWT
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
296-24847-5-ND
|
DigiKey | IC MPU OMAP-L1X 300MHZ 361NFBGA Min Qty: 90 Container: Tube |
0 Tube |
|
$26.8106 | Buy Now |
|
|
Vyrian | Digital Signal Processor, 16-Ext Bit, 50MHz, CMOS, PBGA361 | 6478 |
|
RFQ |
US Tariff Estimator: XOMAPL138ZWT by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
XOMAPL138ZWT Part Data Attributes
|
|
XOMAPL138ZWT
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
XOMAPL138ZWT
Texas Instruments
XOMAPL138ZWT
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | BGA | |
| Package Description | 16 X 16 Mm, 0.80 Mm, Lead Free, Plastic, Nfbga-361 | |
| Pin Count | 361 | |
| HTS Code | 8542.31.00.30 | |
| JESD-30 Code | S-PBGA-B361 | |
| Length | 16 Mm | |
| Number of Terminals | 361 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA361,19X19,32 | |
| Package Shape | Square | |
| Package Style | Grid Array, Low Profile, Fine Pitch | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 Mm | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.8 Mm | |
| Terminal Position | Bottom | |
| Width | 16 Mm | |
| uPs/uCs/Peripheral ICs Type | Soc |
XOMAPL138ZWT Frequently Asked Questions (FAQ)
-
Texas Instruments recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to improve heat dissipation. Additionally, keeping the decoupling capacitors close to the device and using a low-ESR capacitor can help reduce thermal resistance.
-
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (TJ) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device. It's also crucial to monitor the device's thermal performance and adjust the system design accordingly.
-
When powering up the XOMAPL138ZWT, it's essential to follow a controlled power sequencing and supply voltage ramp-up to prevent damage or malfunction. Texas Instruments recommends a slow ramp-up of the supply voltage (typically 1-10 ms) and ensuring that the input voltage is stable before enabling the device. Additionally, consider using a power sequencing controller or a voltage supervisor to ensure proper power-up and power-down sequences.
-
To optimize power consumption and reduce heat generation, consider using the device's power-saving features, such as dynamic voltage and frequency scaling, and clock gating. Additionally, optimize the system's clock frequency, use a low-power mode when possible, and consider using a power management IC to regulate the power supply. It's also essential to minimize the device's idle time and use a low-power state when not in use.
-
To minimize EMI and ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components. Additionally, consider using a spread spectrum clock generator to reduce EMI, and ensure that the system meets the relevant EMC standards and regulations.