Part Details for ADG759BCP by Rochester Electronics LLC
Overview of ADG759BCP by Rochester Electronics LLC
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Part Details for ADG759BCP
ADG759BCP CAD Models
ADG759BCP Part Data Attributes
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ADG759BCP
Rochester Electronics LLC
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Datasheet
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ADG759BCP
Rochester Electronics LLC
4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | QFN | |
Package Description | 4 X 4 MM, CSP-20 | |
Pin Count | 20 | |
Reach Compliance Code | unknown | |
Additional Feature | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | |
Analog IC - Other Type | DIFFERENTIAL MULTIPLEXER | |
JESD-30 Code | S-XQCC-N20 | |
JESD-609 Code | e0 | |
Length | 4 mm | |
Moisture Sensitivity Level | 3 | |
Neg Supply Voltage-Max (Vsup) | -2.75 V | |
Neg Supply Voltage-Min (Vsup) | -2.25 V | |
Neg Supply Voltage-Nom (Vsup) | -2.5 V | |
Number of Channels | 4 | |
Number of Functions | 1 | |
Number of Terminals | 20 | |
Off-state Isolation-Nom | 60 dB | |
On-state Resistance Match-Nom | 0.4 Ω | |
On-state Resistance-Max (Ron) | 4.5 Ω | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 240 | |
Seated Height-Max | 0.9 mm | |
Supply Voltage-Max (Vsup) | 2.75 V | |
Supply Voltage-Min (Vsup) | 2.25 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Switch-off Time-Max | 15 ns | |
Switch-on Time-Max | 25 ns | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4 mm |