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High Performance Fourth Generation DSP
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
60AK5645
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Newark | Dsp, 400Mhz, 1 Core, Cspbga-324, Dsp Type:Floating Point, Data Bus Width:64 Bit, Operating Frequency Max:400Mhz, Ic Case/Package:Cspbga, No. Of Pins:324Pins, No. Of Mips:-, Interfaces:I2C, Spi, Uart, Ram Memory Size:5Mbit Rohs Compliant: Yes |Analog Devices ADSP-21469BBCZ-3 Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 298 |
|
$45.0900 / $53.5300 | Buy Now |
DISTI #
ADSP-21469BBCZ-3-ND
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DigiKey | IC DSP 32/40BIT 400MHZ 324BGA Min Qty: 1 Lead time: 10 Weeks Container: Tray |
104 In Stock |
|
$45.0932 / $53.5300 | Buy Now |
DISTI #
584-ADSP-21469BBCZ-3
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC 400MHz, 324-ld BGA SHARC w/5 Mbits Ram RoHS: Compliant | 100 |
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$44.8300 / $53.5300 | Buy Now |
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Analog Devices Inc | 400MHz, 324-ld BGA SHARC w/5 Mb Min Qty: 1 Package Multiple: 1 | 21 |
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$30.0800 / $53.5300 | Buy Now |
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ADSP-21469BBCZ-3
Analog Devices Inc
Buy Now
Datasheet
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ADSP-21469BBCZ-3
Analog Devices Inc
High Performance Fourth Generation DSP
|
Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | BGA | |
Package Description | 19 X 19 MM, ROHS COMPLIANT, MO-192AAG1, CSPBGA-324 | |
Pin Count | 324 | |
Manufacturer Package Code | BC-324-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Analog Devices | |
Address Bus Width | 24 | |
Barrel Shifter | YES | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 66.66 MHz | |
External Data Bus Width | 8 | |
Format | FLOATING POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e1 | |
Length | 19 mm | |
Low Power Mode | NO | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 324 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (words) | 163840 | |
Seated Height-Max | 1.8 mm | |
Supply Current-Max | 10 mA | |
Supply Voltage-Max | 1.1 V | |
Supply Voltage-Min | 1 V | |
Supply Voltage-Nom | 1.05 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, MIXED |