Part Details for ADSP-BF701KBCZ-2 by Analog Devices Inc
Overview of ADSP-BF701KBCZ-2 by Analog Devices Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for ADSP-BF701KBCZ-2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
505-ADSP-BF701KBCZ-2-ND
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DigiKey | IC DSP LP 128KB L2SR 184BGA Min Qty: 66 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
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$14.0885 | Buy Now |
DISTI #
584-ADSP-BF701KBCZ-2
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface RoHS: Compliant | 32 |
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$12.6000 / $15.9900 | Buy Now |
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Analog Devices Inc | LowPower BF+Embedded Proc W/12 Min Qty: 1 Package Multiple: 1 | 583 |
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$7.1700 / $7.4000 | Buy Now |
DISTI #
35211094
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Verical | DSP 16bit/32bit 200MHz 184-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 66 Package Multiple: 66 | Americas - 528 |
|
$10.7714 | Buy Now |
DISTI #
ADSP-BF701KBCZ2
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Richardson RFPD | MICROCONTROLLER IC RoHS: Compliant Min Qty: 66 | 0 |
|
$9.8600 / $10.5400 | Buy Now |
Part Details for ADSP-BF701KBCZ-2
ADSP-BF701KBCZ-2 CAD Models
ADSP-BF701KBCZ-2 Part Data Attributes:
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ADSP-BF701KBCZ-2
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-BF701KBCZ-2
Analog Devices Inc
Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Package Description | BGA-184 | |
Pin Count | 184 | |
Manufacturer Package Code | BC-184-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Analog Devices | |
Address Bus Width | 14 | |
Barrel Shifter | YES | |
Boundary Scan | YES | |
Clock Frequency-Max | 60 MHz | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B184 | |
JESD-609 Code | e1 | |
Length | 12 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 184 | |
Number of Timers | 8 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA184,14X14,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |