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ADSP-BF701KBCZ-2 by:

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface

Part Details for ADSP-BF701KBCZ-2 by Analog Devices Inc

Overview of ADSP-BF701KBCZ-2 by Analog Devices Inc

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Applications Industrial Automation Renewable Energy Robotics and Drones

Price & Stock for ADSP-BF701KBCZ-2

Part # Distributor Description Stock Price Buy
DISTI # 505-ADSP-BF701KBCZ-2-ND
DigiKey IC DSP LP 128KB L2SR 184BGA Min Qty: 66 Lead time: 20 Weeks Container: Tray Temporarily Out of Stock
  • 66 $14.0885
$14.0885 Buy Now
DISTI # 584-ADSP-BF701KBCZ-2
Mouser Electronics Digital Signal Processors & Controllers - DSP, DSC Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface RoHS: Compliant 32
  • 1 $15.9900
  • 10 $14.7000
  • 25 $14.3800
  • 100 $13.0200
  • 189 $12.8200
  • 567 $12.6000
$12.6000 / $15.9900 Buy Now
Analog Devices Inc LowPower BF+Embedded Proc W/12 Min Qty: 1 Package Multiple: 1 583
  • 1 $7.4000
  • 1,000 $7.1700
$7.1700 / $7.4000 Buy Now
DISTI # 35211094
Verical DSP 16bit/32bit 200MHz 184-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 66 Package Multiple: 66 Americas - 528
  • 66 $10.7714
$10.7714 Buy Now
DISTI # ADSP-BF701KBCZ2
Richardson RFPD MICROCONTROLLER IC RoHS: Compliant Min Qty: 66 0
  • 66 $10.5400
  • 100 $10.2500
  • 500 $9.9900
  • 1,000 $9.8600
$9.8600 / $10.5400 Buy Now

Part Details for ADSP-BF701KBCZ-2

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ADSP-BF701KBCZ-2 Part Data Attributes:

ADSP-BF701KBCZ-2 Analog Devices Inc
Buy Now Datasheet
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ADSP-BF701KBCZ-2 Analog Devices Inc Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description BGA-184
Pin Count 184
Manufacturer Package Code BC-184-1
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Samacsys Manufacturer Analog Devices
Address Bus Width 14
Barrel Shifter YES
Boundary Scan YES
Clock Frequency-Max 60 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B184
JESD-609 Code e1
Length 12 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Serial I/Os 4
Number of Terminals 184
Number of Timers 8
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA184,14X14,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
ROM Programmability FLASH
Seated Height-Max 1.7 mm
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

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