Part Details for AF8GUDI-WACXM by ATP Electronics Inc
Overview of AF8GUDI-WACXM by ATP Electronics Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for AF8GUDI-WACXM
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
1282-AF8GUDI-WACXM-ND
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DigiKey | MEMORY CARD MICROSDHC 8GB SLC Min Qty: 1 Lead time: 10 Weeks Container: Tray |
260 In Stock |
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$112.2915 / $132.8100 | Buy Now |
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DISTI #
AF8GUDI-WACXM
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Avnet Americas | MicroSD Flash card, 8GB, Single-Level Cell (SLC), Industrial Grade, SD3.0 UHS-I, 15mm x 11mm x 1mm - Bulk (Alt: AF8GUDI-WACXM) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 8 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ | |
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DISTI #
162-AF8GUDI-WACXM
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Mouser Electronics | Memory Cards microSD 6.0 Industrial Grade 8GB SLC mode I-Temp. | 79 |
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$104.4700 / $128.3300 | Buy Now |
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NAC | RoHS: Compliant Package Multiple: 1 | 0 |
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RFQ |
Part Details for AF8GUDI-WACXM
AF8GUDI-WACXM CAD Models
AF8GUDI-WACXM Part Data Attributes:
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AF8GUDI-WACXM
ATP Electronics Inc
Buy Now
Datasheet
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Compare Parts:
AF8GUDI-WACXM
ATP Electronics Inc
Memory Circuit, 8GX8, CMOS, PACKAGE
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | ATP ELECTRONICS INC | |
| Package Description | PACKAGE | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Samacsys Manufacturer | ATP Electronics, Inc. | |
| JESD-30 Code | X-XUUC-N | |
| Memory Density | 68719476736 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Words | 8589934592 words | |
| Number of Words Code | 8000000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8GX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Shape | UNSPECIFIED | |
| Package Style | UNCASED CHIP | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER |