Part Details for AM2634CODFHAZCZR by Texas Instruments
Overview of AM2634CODFHAZCZR by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Renewable Energy
Communication and Networking
Automotive
Robotics and Drones
Price & Stock for AM2634CODFHAZCZR
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
296-AM2634CODFHAZCZRCT-ND
|
DigiKey | QUAD-CORE ARM CORTEX-R5F MCU UP Min Qty: 1 Lead time: 18 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
985 In Stock |
|
$11.8250 / $20.0400 | Buy Now |
DISTI #
595-AM2634CODFHAZCZR
|
Mouser Electronics | ARM Microcontrollers - MCU Quad-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security 324-NFBGA -40 to 105 RoHS: Compliant | 960 |
|
$11.4200 / $21.4100 | Buy Now |
Part Details for AM2634CODFHAZCZR
AM2634CODFHAZCZR CAD Models
AM2634CODFHAZCZR Part Data Attributes
|
AM2634CODFHAZCZR
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
AM2634CODFHAZCZR
Texas Instruments
Quad-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security 324-NFBGA -40 to 105
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | NFBGA-324 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Additional Feature | 256KBYTES TCM MEMORY ALSO AVAILABLE | |
Clock Frequency-Max | 400 MHz | |
JESD-30 Code | S-PBGA-B324 | |
Length | 15 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 324 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | SoC |