Part Details for AM2634COMFHAZCZR by Texas Instruments
Overview of AM2634COMFHAZCZR by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Renewable Energy
Communication and Networking
Automotive
Robotics and Drones
Price & Stock for AM2634COMFHAZCZR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-AM2634COMFHAZCZRCT-ND
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DigiKey | IC MCU 64BIT 256KB TCM 324NFBGA Min Qty: 1 Lead time: 18 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
1468 In Stock |
|
$17.1412 / $25.4500 | Buy Now |
DISTI #
595-AM2634COMFHAZCZR
|
Mouser Electronics | ARM Microcontrollers - MCU Quad-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security 324-NFBGA -40 to 105 RoHS: Compliant | 0 |
|
$17.1300 / $25.4400 | Order Now |
|
Ameya Holding Limited | 7423 |
|
RFQ |
Part Details for AM2634COMFHAZCZR
AM2634COMFHAZCZR CAD Models
AM2634COMFHAZCZR Part Data Attributes
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AM2634COMFHAZCZR
Texas Instruments
Buy Now
Datasheet
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AM2634COMFHAZCZR
Texas Instruments
Quad-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security 324-NFBGA -40 to 105
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | NFBGA-324 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Additional Feature | 256KBYTES TCM MEMORY ALSO AVAILABLE | |
Clock Frequency-Max | 400 MHz | |
JESD-30 Code | S-PBGA-B324 | |
Length | 15 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 324 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | SoC |