Datasheets
AM27512-30DI by:

UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Part Details for AM27512-30DI by AMD

Overview of AM27512-30DI by AMD

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Applications Consumer Electronics Industrial Automation

Price & Stock for AM27512-30DI

Part # Distributor Description Stock Price Buy
Quest Components   10
  • 1 $3.9600
  • 2 $2.9700
  • 9 $2.4750
$2.4750 / $3.9600 Buy Now

Part Details for AM27512-30DI

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AM27512-30DI Part Data Attributes

AM27512-30DI AMD
Buy Now Datasheet
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AM27512-30DI AMD UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 300 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.1475 mm
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27512-30DI

This table gives cross-reference parts and alternative options found for AM27512-30DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27512-30DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TMS27C512-30JL 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27512-30DI vs TMS27C512-30JL
AM27512-30DE UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27512-30DE
AM27C512-300/BXA UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27C512-300/BXA
TMS27C512-3JL4 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27512-30DI vs TMS27C512-3JL4
AM27C512-300DC UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27C512-300DC
M27512-3F1 64KX8 UVPROM, 300ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics AM27512-30DI vs M27512-3F1
AM27512-3DC UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27512-3DC
TMS27C512-30JL4 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27512-30DI vs TMS27C512-30JL4
TMS27C512-3JL 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27512-30DI vs TMS27C512-3JL
AM27512-3DE UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27512-3DE
Part Number Description Manufacturer Compare
TMX27C512-3JL 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, CERDIP-28 Texas Instruments AM27512-30DI vs TMX27C512-3JL
AM27512-3DE UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27512-3DE
TMS27C512-30JL 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27512-30DI vs TMS27C512-30JL
AM27C512-300DE UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27C512-300DE
AM27512-30DE UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27512-30DE
AM27C512-300/BXA UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27C512-300/BXA
TMS27C512-3JL4 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27512-30DI vs TMS27C512-3JL4
AM27512-3DC UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27512-3DC
AM27C512-300DC UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27C512-300DC
AM27C512-300DEB UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27512-30DI vs AM27C512-300DEB

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