Part Details for AM27C256-105DC by AMD
Overview of AM27C256-105DC by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
| AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Price & Stock for AM27C256-105DC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Bristol Electronics | 96 |
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RFQ |
Part Details for AM27C256-105DC
AM27C256-105DC CAD Models
AM27C256-105DC Part Data Attributes
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AM27C256-105DC
AMD
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Datasheet
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AM27C256-105DC
AMD
UVPROM, 32KX8, 100ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 100 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-105DC
This table gives cross-reference parts and alternative options found for AM27C256-105DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-105DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS27C256-10JE4 | 32KX8 UVPROM, 100ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C256-105DC vs TMS27C256-10JE4 |
| TMS27C256-10JL4 | 32KX8 UVPROM, 100ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C256-105DC vs TMS27C256-10JL4 |
| M27C256B-10XF1 | 32KX8 UVPROM, 100ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-105DC vs M27C256B-10XF1 |
| M27C256B-10F7X | 32KX8 UVPROM, 100ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | AM27C256-105DC vs M27C256B-10F7X |
| AM27C256-105DCB | UVPROM, 32KX8, 100ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-105DC vs AM27C256-105DCB |
| TMS27C256-100JL4 | 32KX8 UVPROM, 100ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-105DC vs TMS27C256-100JL4 |
| M27C256B-10XF3 | 32KX8 UVPROM, 100ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-105DC vs M27C256B-10XF3 |
| M27C256B-10XF1X | 32KX8 UVPROM, 100ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | AM27C256-105DC vs M27C256B-10XF1X |
| AM27C256-105DI | UVPROM, 32KX8, 100ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-105DC vs AM27C256-105DI |