Part Details for AM99C165-55DM by AMD
Overview of AM99C165-55DM by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 27C512-55DM/B | Rochester Electronics LLC | 27C512 - 512K (64K x 8) CMOS EPROM | |
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| 8655DMES2B13KLF | Amphenol Communications Solutions | D-Sub Accessories, Input Output Connectors, 9 way Angle exit full metal hood with rubber grommet, short screws |
Part Details for AM99C165-55DM
AM99C165-55DM CAD Models
AM99C165-55DM Part Data Attributes
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AM99C165-55DM
AMD
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Datasheet
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AM99C165-55DM
AMD
Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| Additional Feature | AUTOMATIC POWER-DOWN | |
| JESD-30 Code | R-GDIP-T24 | |
| Length | 31.9405 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 16KX4 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Voltage-Min | 2 V | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.62 mm |
Alternate Parts for AM99C165-55DM
This table gives cross-reference parts and alternative options found for AM99C165-55DM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM99C165-55DM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8685914XX | Standard SRAM, 16KX4, 55ns, CMOS, 0.560 X 0.358 INCH, 0.120 HEIGHT, LCC-28 | Integrated Device Technology Inc | AM99C165-55DM vs 5962-8685914XX |
| AM99C165-55DC | Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM99C165-55DM vs AM99C165-55DC |
| P4C198L-55LMB | Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, 0.350 X 0.550 INCH, HERMETIC SEALED, CERAMIC, LCC-28 | Pyramid Semiconductor Corporation | AM99C165-55DM vs P4C198L-55LMB |
| 5962-8685913LX | Standard SRAM, 16KX4, 55ns, CMOS, 1.280 X 0.310 INCH, 0.200 HEIGHT, DIP-24 | Integrated Device Technology Inc | AM99C165-55DM vs 5962-8685913LX |
| 5962-8685914LC | 16KX4 STANDARD SRAM, 55ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | STMicroelectronics | AM99C165-55DM vs 5962-8685914LC |
| MT5C6405EC-55/883C | Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, CERAMIC, LCC-28 | Micross Components | AM99C165-55DM vs MT5C6405EC-55/883C |
| HM1-65789N-2 | Standard SRAM, 16KX4, 55ns, CMOS, CDIP24 | Matra MHS | AM99C165-55DM vs HM1-65789N-2 |
| P4C198-55DMB | Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, CERDIP-24 | Pyramid Semiconductor Corporation | AM99C165-55DM vs P4C198-55DMB |
| 5962-8685913UA | Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, CERAMIC, LCC-28 | Micross Components | AM99C165-55DM vs 5962-8685913UA |
| MT5C6405EC-55/XT | Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, CERAMIC, LCC-28 | Micross Components | AM99C165-55DM vs MT5C6405EC-55/XT |