Part Details for AS6C2008-55BIN by Alliance Memory Inc
Overview of AS6C2008-55BIN by Alliance Memory Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for AS6C2008-55BIN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1450-1171-ND
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DigiKey | IC SRAM 2MBIT PARALLEL 36TFBGA Min Qty: 480 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$3.0446 | Buy Now |
DISTI #
AS6C2008-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA - Trays (Alt: AS6C2008-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 56 Factory Stock |
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$2.2750 / $2.8906 | Buy Now |
DISTI #
913-AS6C2008-55BIN
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Mouser Electronics | SRAM LP SRAM, 2Mb, 256K x 8, 3V, 36pin TFBGA (6 x 8mm), 55ns, Industrial Temp - Tray RoHS: Compliant | 0 |
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$2.8500 / $2.9300 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 480 Package Multiple: 480 Container: Tray | 0Tray |
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$2.3200 | Buy Now |
DISTI #
AS6C2008-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA - Trays (Alt: AS6C2008-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 56 Factory Stock |
|
$2.2750 / $2.8906 | Buy Now |
DISTI #
AS6C2008-55BIN
|
Avnet Americas | SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA - Trays (Alt: AS6C2008-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 56 Factory Stock |
|
$2.2750 / $2.8906 | Buy Now |
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Karl Kruse GmbH & Co KG | LP SRAM 2Mb 256K x 8 3V 36pin TFBGA (6 x 8mm) 55ns Industrial Temp | 56 |
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RFQ | |
DISTI #
AS6C2008-55BIN
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Avnet Silica | SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA (Alt: AS6C2008-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 2 Weeks, 1 Days | Silica - 480 |
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Buy Now |
Part Details for AS6C2008-55BIN
AS6C2008-55BIN CAD Models
AS6C2008-55BIN Part Data Attributes
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AS6C2008-55BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS6C2008-55BIN
Alliance Memory Inc
Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, 6 X 8 MM, ROHS COMPLIANT, TFBGA-36
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Part Package Code | BGA | |
Pin Count | 36 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Samacsys Manufacturer | Alliance Memory | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B36 | |
Length | 8 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA36,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.00001 A | |
Standby Voltage-Min | 1.5 V | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 6 mm |
Alternate Parts for AS6C2008-55BIN
This table gives cross-reference parts and alternative options found for AS6C2008-55BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS6C2008-55BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
V62C2802048LL-55B | Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 | Mosel Vitelic Corporation | AS6C2008-55BIN vs V62C2802048LL-55B |
K6F2008U2E-YF550 | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32 | Samsung Semiconductor | AS6C2008-55BIN vs K6F2008U2E-YF550 |
V62C3802048L-55T | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | Mosel Vitelic Corporation | AS6C2008-55BIN vs V62C3802048L-55T |
W24B02T-55LI | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Winbond Electronics Corp | AS6C2008-55BIN vs W24B02T-55LI |
V62C2182048LL-55T | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, TSOP-32 | Mosel Vitelic Corporation | AS6C2008-55BIN vs V62C2182048LL-55T |
V62C2802096LL-55T | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | Mosel Vitelic Corporation | AS6C2008-55BIN vs V62C2802096LL-55T |
IS62UT2568SL-55B | Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, MINI, BGA-36 | Integrated Silicon Solution Inc | AS6C2008-55BIN vs IS62UT2568SL-55B |
V62C2802048LL-55TI | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 | Mosel Vitelic Corporation | AS6C2008-55BIN vs V62C2802048LL-55TI |
V62C2802048L-55BI | Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 | Mosel Vitelic Corporation | AS6C2008-55BIN vs V62C2802048L-55BI |
AS6C2008-55TIN | Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, ROHS COMPLIANT, TSOP1-32 | Alliance Memory Inc | AS6C2008-55BIN vs AS6C2008-55TIN |