Part Details for AS6C3216-55BIN by Alliance Memory Inc
Overview of AS6C3216-55BIN by Alliance Memory Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for AS6C3216-55BIN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
AS6C3216-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 32M-Bit 2M x 16 55ns 48-Pin TFBGA Tray - Trays (Alt: AS6C3216-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 0 |
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RFQ | |
DISTI #
AS6C3216-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 32M-Bit 2M x 16 55ns 48-Pin TFBGA Tray - Trays (Alt: AS6C3216-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 0 |
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RFQ |
Part Details for AS6C3216-55BIN
AS6C3216-55BIN CAD Models
AS6C3216-55BIN Part Data Attributes:
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AS6C3216-55BIN
Alliance Memory Inc
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Datasheet
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Compare Parts:
AS6C3216-55BIN
Alliance Memory Inc
Standard SRAM, 2MX16, 55ns, CMOS, PBGA48, 8 X 10 MM, ROHS COMPLIANT, MO-207, TFBGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | LFBGA, BGA48,6X8,30 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | ||
Samacsys Manufacturer | Alliance Memory | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B48 | |
Length | 10 mm | |
Memory Density | 33554432 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.002 A | |
Standby Voltage-Min | 1.2 V | |
Supply Current-Max | 0.08 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |
Alternate Parts for AS6C3216-55BIN
This table gives cross-reference parts and alternative options found for AS6C3216-55BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS6C3216-55BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AS6C3216-55BINTR | Standard SRAM, 2MX16, 55ns, CMOS, PBGA48, 8 X 10 MM, ROHS COMPLIANT, MO-207, TFBGA-48 | Alliance Memory Inc | AS6C3216-55BIN vs AS6C3216-55BINTR |