Part Details for AT91SAM9G45-CU-999 by Microchip Technology Inc
Overview of AT91SAM9G45-CU-999 by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for AT91SAM9G45-CU-999
AT91SAM9G45-CU-999 CAD Models
AT91SAM9G45-CU-999 Part Data Attributes
|
AT91SAM9G45-CU-999
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
AT91SAM9G45-CU-999
Microchip Technology Inc
RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA324
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | TFBGA-324 | |
Reach Compliance Code | unknown | |
Address Bus Width | 26 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 50 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B324 | |
Length | 15 mm | |
Low Power Mode | YES | |
Number of DMA Channels | 37 | |
Number of External Interrupts | 1 | |
Number of Serial I/Os | 7 | |
Number of Terminals | 324 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
RAM (words) | 65536 | |
Seated Height-Max | 1.2 mm | |
Speed | 400 MHz | |
Supply Voltage-Max | 1.1 V | |
Supply Voltage-Min | 0.9 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |