Part Details for AT91SAM9R64-CU-999 by Microchip Technology Inc
Overview of AT91SAM9R64-CU-999 by Microchip Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for AT91SAM9R64-CU-999
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
68T5215
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Newark | Bga Green, Ind Temp, T&r 144 Lfbga 10X10X1.4Mm T/R Rohs Compliant: Yes |Microchip AT91SAM9R64-CU-999 Min Qty: 1000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
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NAC | BGA GREEN, IND TEMP, T&R - Package: 144 LFBGA 10x10x1.4mm T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1000 | 0 |
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RFQ |
Part Details for AT91SAM9R64-CU-999
AT91SAM9R64-CU-999 CAD Models
AT91SAM9R64-CU-999 Part Data Attributes:
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AT91SAM9R64-CU-999
Microchip Technology Inc
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Datasheet
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AT91SAM9R64-CU-999
Microchip Technology Inc
IC MCU 32BIT 32KB ROM 144BGA
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Microchip | |
| Has ADC | YES | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | ARM926EJ-S | |
| Clock Frequency-Max | 16 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B144 | |
| Length | 10 mm | |
| Low Power Mode | YES | |
| Number of DMA Channels | 2 | |
| Number of External Interrupts | 1 | |
| Number of I/O Lines | 49 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 144 | |
| Number of Timers | 4 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA144,12X12,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 65536 | |
| ROM (words) | 32768 | |
| ROM Programmability | MROM | |
| Seated Height-Max | 1.4 mm | |
| Speed | 200 MHz | |
| Supply Current-Max | 30 mA | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |