Part Details for BAS70L,315 by NXP Semiconductors
Overview of BAS70L,315 by NXP Semiconductors
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Part Details for BAS70L,315
BAS70L,315 CAD Models
BAS70L,315 Part Data Attributes
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BAS70L,315
NXP Semiconductors
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BAS70L,315
NXP Semiconductors
BAS70 series; 1PS7xSB70 series - General-purpose Schottky diodes DFN 2-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | DFN | |
| Package Description | PLASTIC PACKAGE-2 | |
| Pin Count | 2 | |
| Manufacturer Package Code | SOD882 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.70 | |
| Case Connection | CATHODE | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 0.41 V | |
| JESD-30 Code | R-PBCC-N2 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 0.1 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Output Current-Max | 0.07 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Rep Pk Reverse Voltage-Max | 70 V | |
| Surface Mount | YES | |
| Technology | SCHOTTKY | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 |