Part Details for BLD6G22LS-50 by NXP Semiconductors
Overview of BLD6G22LS-50 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Environmental Monitoring
Industrial Automation
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Price & Stock for BLD6G22LS-50
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 2 CHANNEL, S BAND, Si, N-CHANNEL, RF POWER, MOSFET | 44 |
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$57.5000 / $65.0000 | Buy Now |
Part Details for BLD6G22LS-50
BLD6G22LS-50 CAD Models
BLD6G22LS-50 Part Data Attributes
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BLD6G22LS-50
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BLD6G22LS-50
NXP Semiconductors
2 CHANNEL, S BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, CERAMIC PACKAGE-4
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FLATPACK, R-CDFP-F4 | |
Pin Count | 4 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
Case Connection | SOURCE | |
Configuration | COMPLEX | |
DS Breakdown Voltage-Min | 65 V | |
Drain Current-Max (ID) | 10.2 A | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Highest Frequency Band | S BAND | |
JESD-30 Code | R-CDFP-F4 | |
Number of Elements | 2 | |
Number of Terminals | 4 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 200 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Application | AMPLIFIER | |
Transistor Element Material | SILICON |