Part Details for BLF6G10LS-135R,118 by NXP Semiconductors
Overview of BLF6G10LS-135R,118 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
HS0-1135RH-Q | Renesas Electronics Corporation | Current Feedback Amp W/VIO Adjust | |
HS7B-1135RH-Q | Renesas Electronics Corporation | Current Feedback Amp W/VIO Adjust |
Part Details for BLF6G10LS-135R,118
BLF6G10LS-135R,118 CAD Models
BLF6G10LS-135R,118 Part Data Attributes
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BLF6G10LS-135R,118
NXP Semiconductors
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Datasheet
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BLF6G10LS-135R,118
NXP Semiconductors
TRANSISTOR RF POWER, FET, ROHS COMPLIANT, CERAMIC PACKAGE-2, FET RF Power
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | ROHS COMPLIANT, CERAMIC PACKAGE-2 | |
Pin Count | 2 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.29.00.75 | |
JESD-30 Code | R-CDFP-F2 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 225 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Form | FLAT | |
Terminal Position | DUAL |