Part Details for BLM6G10-30G,118 by NXP Semiconductors
Overview of BLM6G10-30G,118 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for BLM6G10-30G,118
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | BLM6G10-30G, LDMOS MMIC, SOT822 (HSOP16) RoHS: Compliant Status: Obsolete Min Qty: 1 | 8 |
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$32.8800 / $38.6800 | Buy Now |
Part Details for BLM6G10-30G,118
BLM6G10-30G,118 CAD Models
BLM6G10-30G,118 Part Data Attributes:
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BLM6G10-30G,118
NXP Semiconductors
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Datasheet
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BLM6G10-30G,118
NXP Semiconductors
BLM6G10-30G
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SOIC | |
Package Description | PLASTIC, SOT822-1, HSOP-16 | |
Pin Count | 16 | |
Manufacturer Package Code | SOT822-1 | |
Reach Compliance Code | not_compliant | |
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e3 | |
Length | 15.9 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 3.6 mm | |
Supply Voltage-Nom | 28 V | |
Surface Mount | YES | |
Telecom IC Type | BASEBAND CIRCUIT | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.37 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 11 mm |