Part Details for BLM6G22-30G,118 by NXP Semiconductors
Overview of BLM6G22-30G,118 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for BLM6G22-30G,118
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Rochester Electronics | BLM6G22 - W-CDMA 2100 MHz to 2200 MHz power MMIC RoHS: Compliant Status: Obsolete Min Qty: 1 | 427 |
|
$33.3600 / $39.2500 | Buy Now |
Part Details for BLM6G22-30G,118
BLM6G22-30G,118 CAD Models
BLM6G22-30G,118 Part Data Attributes:
|
|
BLM6G22-30G,118
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
BLM6G22-30G,118
NXP Semiconductors
BLM6G22-30G
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOIC | |
| Package Description | ROHS COMPLIANT, PLASTIC, SOT822-1, SOP-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | SOT822-1 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Terminal Finish | Tin (Sn) | |
| Time@Peak Reflow Temperature-Max (s) | 30 |