Part Details for BU4066BF by ROHM Semiconductor
Overview of BU4066BF by ROHM Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Communication and Networking
Automotive
Price & Stock for BU4066BF
Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 2264 |
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RFQ |
Part Details for BU4066BF
BU4066BF CAD Models
BU4066BF Part Data Attributes:
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BU4066BF
ROHM Semiconductor
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Datasheet
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BU4066BF
ROHM Semiconductor
SPST, 4 Func, 1 Channel, CMOS, PDSO14, SOP-14
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ROHM CO LTD | |
Part Package Code | SOIC | |
Package Description | LSOP, SOP14,.25 | |
Pin Count | 14 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Analog IC - Other Type | SPST | |
JESD-30 Code | R-PDSO-G14 | |
JESD-609 Code | e0 | |
Length | 8.7 mm | |
Normal Position | NO | |
Number of Channels | 1 | |
Number of Functions | 4 | |
Number of Terminals | 14 | |
On-state Resistance-Max (Ron) | 950 Ω | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output | SEPARATE OUTPUT | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSOP | |
Package Equivalence Code | SOP14,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max (Vsup) | 16 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 4.4 mm |