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Overview of C165LF3VHABXUMA1 by Infineon Technologies AG
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for C165LF3VHABXUMA1 by Infineon Technologies AG
Part Data Attributes for C165LF3VHABXUMA1 by Infineon Technologies AG
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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INFINEON TECHNOLOGIES AG
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Package Description
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0.50 MM PITCH, GREEN, PLASTIC, TQFP-100
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Reach Compliance Code
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compliant
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Factory Lead Time
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4 Weeks
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Has ADC
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NO
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Address Bus Width
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24
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Bit Size
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16
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Boundary Scan
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NO
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Clock Frequency-Max
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40 MHz
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DAC Channels
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NO
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DMA Channels
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NO
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External Data Bus Width
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16
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JESD-30 Code
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S-PQFP-G100
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JESD-609 Code
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e3
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Length
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14 mm
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Moisture Sensitivity Level
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3
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Number of I/O Lines
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77
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Number of Terminals
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100
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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PWM Channels
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YES
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LFQFP
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Package Shape
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SQUARE
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Package Style
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FLATPACK, LOW PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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ROM (words)
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0
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ROM Programmability
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ROM LESS
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Seated Height-Max
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1.6 mm
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Speed
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20 MHz
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Supply Voltage-Max
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3.6 V
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Supply Voltage-Min
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3 V
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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Tin (Sn)
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Terminal Form
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GULL WING
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Terminal Pitch
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0.5 mm
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Terminal Position
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QUAD
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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14 mm
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uPs/uCs/Peripheral ICs Type
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MICROCONTROLLER
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