Part Details for C8051F537-C-IT by Silicon Laboratories Inc
Overview of C8051F537-C-IT by Silicon Laboratories Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for C8051F537-C-IT
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
C8051F537-C-IT-ND
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DigiKey | IC MCU 8BIT 2KB FLASH 20TSSOP Min Qty: 1554 Lead time: 20 Weeks Container: Tube | Limited Supply - Call |
|
$3.5209 | Buy Now |
DISTI #
C8051F537-C-IT
|
TME | IC: microcontroller 8051, Interface: SPI,UART, 2÷5.25VDC, TSSOP20 Min Qty: 1 | 0 |
|
$2.9300 / $3.4300 | RFQ |
Part Details for C8051F537-C-IT
C8051F537-C-IT CAD Models
C8051F537-C-IT Part Data Attributes
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C8051F537-C-IT
Silicon Laboratories Inc
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Datasheet
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C8051F537-C-IT
Silicon Laboratories Inc
Microcontroller, TSSOP-20
|
Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | SILICON LABORATORIES INC | |
Package Description | TSSOP-20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 8 | |
Boundary Scan | NO | |
CPU Family | 8051 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e3 | |
Length | 6.5 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of External Interrupts | 2 | |
Number of I/O Lines | 16 | |
Number of Serial I/Os | 1 | |
Number of Terminals | 20 | |
Number of Timers | 3 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP20,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 256 | |
ROM (words) | 2048 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.2 mm | |
Speed | 25 MHz | |
Supply Current-Max | 13 mA | |
Supply Voltage-Max | 2.75 V | |
Supply Voltage-Min | 2 V | |
Supply Voltage-Nom | 2.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 4.4 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |