Part Details for CS26LV16173HCP70 by Chiplus Semiconductor Corp
Overview of CS26LV16173HCP70 by Chiplus Semiconductor Corp
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Part Details for CS26LV16173HCP70
CS26LV16173HCP70 CAD Models
CS26LV16173HCP70 Part Data Attributes
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CS26LV16173HCP70
Chiplus Semiconductor Corp
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Datasheet
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CS26LV16173HCP70
Chiplus Semiconductor Corp
Pseudo Static RAM, 1MX16, 70ns, CMOS, PBGA48, 6 X 7 MM, LEAD FREE, MINI BGA-48
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| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | CHIPLUS SEMICONDUCTOR CORP | |
| Package Description | 6 X 7 MM, LEAD FREE, MINI BGA-48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 8 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | PSEUDO STATIC RAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm |