Part Details for CS26LV64173HCP70 by Chiplus Semiconductor Corp
Overview of CS26LV64173HCP70 by Chiplus Semiconductor Corp
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Part Details for CS26LV64173HCP70
CS26LV64173HCP70 CAD Models
CS26LV64173HCP70 Part Data Attributes
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CS26LV64173HCP70
Chiplus Semiconductor Corp
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CS26LV64173HCP70
Chiplus Semiconductor Corp
Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, ROHS COMPLIANT, MINI BGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | CHIPLUS SEMICONDUCTOR CORP | |
Package Description | 6 X 8 MM, ROHS COMPLIANT, MINI BGA-48 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 70 ns | |
JESD-30 Code | R-PBGA-B48 | |
Length | 8 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | PSEUDO STATIC RAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 6 mm |