Part Details for CY62162G18-55BGXI by Infineon Technologies AG
Overview of CY62162G18-55BGXI by Infineon Technologies AG
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Consumer Electronics
Price & Stock for CY62162G18-55BGXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-CY62162G18-55BGXI-ND
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DigiKey | IC SRAM 16MBIT PARALLEL 119PBGA Min Qty: 840 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$14.6703 | Buy Now |
|
DISTI #
CY62162G18-55BGXI
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Avnet Americas | SRAM Chip Sync Single 1.8V 16M-Bit 512K x 32 55ns 119-Pin P-BGA Tray - Trays (Alt: CY62162G18-55BGXI) RoHS: Compliant Min Qty: 840 Package Multiple: 84 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$17.0500 | Buy Now |
|
DISTI #
727-CY62162G1855BGXI
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Mouser Electronics | SRAM ASYNC RoHS: Compliant | 0 |
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$14.1800 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 840 Package Multiple: 840 Container: Tray | 0Tray |
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$13.7500 | Buy Now |
|
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Rochester Electronics | CY62162G - 16-Mbit (512K 32) Static RAM with Error-Correcting Code (ECC) RoHS: Compliant Status: Active Min Qty: 1 | 222 |
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$13.6400 / $16.0400 | Buy Now |
|
DISTI #
CY62162G18-55BGXI
|
Avnet Americas | SRAM Chip Sync Single 1.8V 16M-Bit 512K x 32 55ns 119-Pin P-BGA Tray - Trays (Alt: CY62162G18-55BGXI) RoHS: Compliant Min Qty: 840 Package Multiple: 84 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$17.0500 | Buy Now |
|
DISTI #
CY62162G18-55BGXI
|
Avnet Americas | SRAM Chip Sync Single 1.8V 16M-Bit 512K x 32 55ns 119-Pin P-BGA Tray - Trays (Alt: CY62162G18-55BGXI) RoHS: Compliant Min Qty: 840 Package Multiple: 84 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$17.0500 | Buy Now |
Part Details for CY62162G18-55BGXI
CY62162G18-55BGXI CAD Models
CY62162G18-55BGXI Part Data Attributes
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CY62162G18-55BGXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY62162G18-55BGXI
Infineon Technologies AG
Standard SRAM, 512KX32, 55ns, CMOS, PBGA119, BGA-119
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-119 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 10 Weeks | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 32 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX32 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 2.4 mm | |
| Standby Current-Max | 0.000026 A | |
| Standby Voltage-Min | 1 V | |
| Supply Current-Max | 0.032 mA | |
| Supply Voltage-Max (Vsup) | 2.2 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |