Part Details for CY62177G30-55BAXI by Infineon Technologies AG
Overview of CY62177G30-55BAXI by Infineon Technologies AG
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY62177G30-55BAXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
66AH9485
|
Newark | Sram, 32Mbit, -40 To 85Deg C, Sram Type:Asynchronous Sram, Memory Configuration:2M X 16Bit/4M X 8Bit, Ic Case/Package:Fbga, No. Of Pins:48Pins, Supply Voltage Min:2.2V, Supply Voltage Max:3.6V, Supply Voltage Nom:3V Rohs Compliant: Yes |Infineon CY62177G30-55BAXI RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$40.2800 | Buy Now |
|
DISTI #
448-CY62177G30-55BAXI-ND
|
DigiKey | IC SRAM 32MBIT PARALLEL 48FBGA Min Qty: 210 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
|
$35.9960 | Buy Now |
|
DISTI #
CY62177G30-55BAXI
|
Avnet Americas | SRAM Chip Async Single 3V 32Mbit 2M X 16/4M X 8 55ns 48-Pin FBGA Tray - Trays (Alt: CY62177G30-55BAXI) RoHS: Compliant Min Qty: 210 Package Multiple: 210 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
727-CY62177G3055BAXI
|
Mouser Electronics | SRAM Y RoHS: Compliant | 0 |
|
$39.4800 / $43.3500 | Order Now |
|
|
Future Electronics | SRAM Micropower SRAMs RoHS: Compliant pbFree: Yes Min Qty: 210 Package Multiple: 210 Lead time: 10 Weeks | 0 |
|
$32.2800 | Buy Now |
|
DISTI #
SP005641969
|
EBV Elektronik | SRAM Chip Async Single 3V 32Mbit 2M X 16/4M X 8 55ns 48-Pin FBGA Tray (Alt: SP005641969) RoHS: Compliant Min Qty: 210 Package Multiple: 210 Lead time: 9 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for CY62177G30-55BAXI
CY62177G30-55BAXI CAD Models
CY62177G30-55BAXI Part Data Attributes
|
|
CY62177G30-55BAXI
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY62177G30-55BAXI
Infineon Technologies AG
Standard SRAM, 2MX16, 55ns, CMOS, PBGA48, FBGA-48
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-48 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e1 | |
| Length | 9.5 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.000019 A | |
| Standby Voltage-Min | 2.2 V | |
| Supply Current-Max | 0.045 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.2 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |