Part Details for CY62177G30-55BKXI by Infineon Technologies AG
Overview of CY62177G30-55BKXI by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY62177G30-55BKXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-CY62177G30-55BKXI-ND
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DigiKey | IC SRAM 32MBIT PARALLEL 48FBGA Min Qty: 4800 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$33.2433 | Buy Now |
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DISTI #
CY62177G30-55BKXI
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Avnet Americas | SRAM Chip Async Single 3V 32Mbit 2M X 16/4M X 8 55ns 48-Pin VFBGA Tray - Trays (Alt: CY62177G30-55BKXI) RoHS: Compliant Min Qty: 4800 Package Multiple: 480 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
727-CY62177G3055BKXI
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Mouser Electronics | SRAM Y RoHS: Compliant | 0 |
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$32.2800 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 4800 Package Multiple: 4800 Lead time: 10 Weeks | 0 |
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$32.2800 | Buy Now |
|
DISTI #
SP005641975
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EBV Elektronik | SRAM Chip Async Single 3V 32Mbit 2M X 16/4M X 8 55ns 48-Pin VFBGA Tray (Alt: SP005641975) RoHS: Compliant Min Qty: 4800 Package Multiple: 4800 Lead time: 9 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for CY62177G30-55BKXI
CY62177G30-55BKXI CAD Models
CY62177G30-55BKXI Part Data Attributes
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CY62177G30-55BKXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY62177G30-55BKXI
Infineon Technologies AG
Standard SRAM, 2MX16, 55ns, CMOS, PBGA48, VFBGA-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | VFBGA-48 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.000019 A | |
| Standby Voltage-Min | 2.2 V | |
| Supply Current-Max | 0.045 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.2 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |