Part Details for CY7C0830AV-167BBC by Rochester Electronics LLC
Overview of CY7C0830AV-167BBC by Rochester Electronics LLC
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Part Details for CY7C0830AV-167BBC
CY7C0830AV-167BBC CAD Models
CY7C0830AV-167BBC Part Data Attributes
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CY7C0830AV-167BBC
Rochester Electronics LLC
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CY7C0830AV-167BBC
Rochester Electronics LLC
64KX18 DUAL-PORT SRAM, 4ns, PBGA144, 13 X 13 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-144
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 13 X 13 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 4 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | S-PBGA-B144 | |
| JESD-609 Code | e0 | |
| Length | 13 mm | |
| Memory Density | 1179648 bit | |
| Memory IC Type | DUAL-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | NOT SPECIFIED | |
| Number of Functions | 1 | |
| Number of Terminals | 144 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |