Part Details for CY7C1034DV33-10BGXI by Infineon Technologies AG
Overview of CY7C1034DV33-10BGXI by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C1034DV33-10BGXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
CY7C1034DV33-10BGX
|
Avnet Americas | SRAM Chip Async Single 3.3V 6M-Bit 256K x 24-Bit 10ns 119-Pin BGA - Trays (Alt: CY7C1034DV33-10BGX) RoHS: Compliant Min Qty: 57 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 219 Partner Stock |
|
$10.9368 / $13.2300 | Buy Now |
Part Details for CY7C1034DV33-10BGXI
CY7C1034DV33-10BGXI CAD Models
CY7C1034DV33-10BGXI Part Data Attributes:
|
|
CY7C1034DV33-10BGXI
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY7C1034DV33-10BGXI
Infineon Technologies AG
Standard SRAM, 256KX24, 10ns, CMOS, PBGA119, BGA-119
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-119 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 10 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| Length | 22 mm | |
| Memory Density | 6291456 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 24 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX24 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 2.4 mm | |
| Standby Current-Max | 0.025 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.175 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |