Datasheets
CY7C1320BV18-250BZC by:

DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

Part Details for CY7C1320BV18-250BZC by Cypress Semiconductor

Overview of CY7C1320BV18-250BZC by Cypress Semiconductor

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Price & Stock for CY7C1320BV18-250BZC

Part # Distributor Description Stock Price Buy
Rochester Electronics DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165 RoHS: Not Compliant Status: Obsolete Min Qty: 1 226
  • 1 $33.8300
  • 25 $33.1600
  • 100 $31.8000
  • 500 $30.4500
  • 1,000 $28.7600
$28.7600 / $33.8300 Buy Now

Part Details for CY7C1320BV18-250BZC

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CY7C1320BV18-250BZC Part Data Attributes

CY7C1320BV18-250BZC Cypress Semiconductor
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CY7C1320BV18-250BZC Cypress Semiconductor DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count 165
Reach Compliance Code not_compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 18874368 bit
Memory IC Type DDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.24 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.55 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for CY7C1320BV18-250BZC

This table gives cross-reference parts and alternative options found for CY7C1320BV18-250BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1320BV18-250BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8182T36BD-200IT DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1320BV18-250BZC vs GS8182T36BD-200IT
CY7C1320BV18-250BZI DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1320BV18-250BZC vs CY7C1320BV18-250BZI
GS8182T36BGD-200IT DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1320BV18-250BZC vs GS8182T36BGD-200IT
GS8182T36BGD-200T DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1320BV18-250BZC vs GS8182T36BGD-200T
CY7C1320AV18-250BZC DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FBGA-165 Cypress Semiconductor CY7C1320BV18-250BZC vs CY7C1320AV18-250BZC
CY7C1320BV18-250BZXI DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1320BV18-250BZC vs CY7C1320BV18-250BZXI
GS8182T36BGD-200I DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1320BV18-250BZC vs GS8182T36BGD-200I
GS8182T36BD-250 DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1320BV18-250BZC vs GS8182T36BD-250
71P71604S200BQ8 CABGA-165, Reel Integrated Device Technology Inc CY7C1320BV18-250BZC vs 71P71604S200BQ8
GS8182T36GBD-200T DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1320BV18-250BZC vs GS8182T36GBD-200T
Part Number Description Manufacturer Compare
IS61DDP2B21M18A-550M3 DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc CY7C1320BV18-250BZC vs IS61DDP2B21M18A-550M3
K7Q163682A-FC13 QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 Samsung Semiconductor CY7C1320BV18-250BZC vs K7Q163682A-FC13
CY7C1345B-50AC Cache SRAM, 128KX36, 11ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor CY7C1320BV18-250BZC vs CY7C1345B-50AC
CY7C1386FV25-250BGI Cache SRAM, 512KX36, 2.6ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 Cypress Semiconductor CY7C1320BV18-250BZC vs CY7C1386FV25-250BGI
CXK77N36R160GB-3 Late-Write SRAM, 512KX36, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Sony Semiconductor CY7C1320BV18-250BZC vs CXK77N36R160GB-3
K7I161884B-FC16 DDR SRAM, 1MX18, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 Samsung Semiconductor CY7C1320BV18-250BZC vs K7I161884B-FC16
AS7C33128NTD36A-200BC ZBT SRAM, 128KX36, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Alliance Semiconductor Corporation CY7C1320BV18-250BZC vs AS7C33128NTD36A-200BC
IS61QDPB21M18A-300B4 QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc CY7C1320BV18-250BZC vs IS61QDPB21M18A-300B4
MCM69L738ZP9R Late-Write SRAM, 128KX36, 10.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 Motorola Semiconductor Products CY7C1320BV18-250BZC vs MCM69L738ZP9R
71V3576YS150BGGI Cache SRAM, 128KX36, 3.8ns, CMOS, PBGA119, ROHS COMPLIANT, BGA-119 Integrated Device Technology Inc CY7C1320BV18-250BZC vs 71V3576YS150BGGI

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