There are no models available for this part yet.
Overview of CY7C1360C-166AXCT by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Automotive
Price & Stock for CY7C1360C-166AXCT by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
CY7C1360C-166AXCT
|
Avnet Americas | SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 3.5ns 100-Pin TQFP T/R - Tape and Reel (Alt: CY7C1360C-166AXCT) RoHS: Compliant Min Qty: 750 Package Multiple: 750 Container: Reel | 0 |
|
RFQ | ||
DISTI #
SP005648075
|
EBV Elektronik | SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 3.5ns 100-Pin TQFP T/R (Alt: SP005648075) RoHS: Compliant Min Qty: 750 Package Multiple: 750 Lead time: 12 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for CY7C1360C-166AXCT by Infineon Technologies AG
Part Data Attributes for CY7C1360C-166AXCT by Infineon Technologies AG
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Reach Compliance Code
|
compliant
|
Samacsys Manufacturer
|
Infineon
|
Access Time-Max
|
3.5 ns
|
Clock Frequency-Max (fCLK)
|
166 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PQFP-G100
|
JESD-609 Code
|
e4
|
Memory Density
|
9437184 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
36
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
100
|
Number of Words
|
262144 words
|
Number of Words Code
|
256000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
256KX36
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QFP
|
Package Equivalence Code
|
QFP100,.63X.87
|
Package Shape
|
RECTANGULAR
|
Package Style
|
FLATPACK
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Standby Current-Max
|
0.04 A
|
Standby Voltage-Min
|
3.14 V
|
Supply Current-Max
|
0.18 mA
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.635 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
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