Datasheets
CY7C1370KV33-200BZXI by:

ZBT SRAM, 512KX36, 3ns, CMOS, PBGA165, FBGA-165

Part Details for CY7C1370KV33-200BZXI by Cypress Semiconductor

Overview of CY7C1370KV33-200BZXI by Cypress Semiconductor

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Applications Internet of Things (IoT) Computing and Data Storage Agriculture Technology

Price & Stock for CY7C1370KV33-200BZXI

Part # Distributor Description Stock Price Buy
Flip Electronics Stock, ship today 208
  • 1 $20.4000
$20.4000 RFQ

Part Details for CY7C1370KV33-200BZXI

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CY7C1370KV33-200BZXI Part Data Attributes

CY7C1370KV33-200BZXI Cypress Semiconductor
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CY7C1370KV33-200BZXI Cypress Semiconductor ZBT SRAM, 512KX36, 3ns, CMOS, PBGA165, FBGA-165
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Package Description FBGA-165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Date Of Intro 2016-08-09
Access Time-Max 3 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

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