Part Details for CY7C1370KV33-200BZXI by Infineon Technologies AG
Overview of CY7C1370KV33-200BZXI by Infineon Technologies AG
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- Number of Functional Equivalents:
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Applications
Internet of Things (IoT)
Computing and Data Storage
Agriculture Technology
Price & Stock for CY7C1370KV33-200BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
22AC5953
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Newark | Sync Srams/Tray Rohs Compliant: Yes |Infineon CY7C1370KV33-200BZXI Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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DISTI #
CY7C1370KV33-200BZXI-ND
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DigiKey | IC SRAM 18MBIT PARALLEL 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray |
272 In Stock |
|
$28.7739 / $38.7300 | Buy Now |
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DISTI #
CY7C1370KV33-200BZXI
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Avnet Americas | SRAM Chip Sync Dual Port 18Mbit 512K X 36Bit/1M X 18Bit 3.3V 165-Pin FBGA Bulk - Trays (Alt: CY7C1370KV33-200BZXI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$29.7640 / $36.1420 | Buy Now |
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DISTI #
727-CY7C1370KV33200B
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Mouser Electronics | SRAM Sync SRAMs RoHS: Compliant | 136 |
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$27.9300 / $37.6000 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 136 Package Multiple: 136 Container: Tray | 0Tray |
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$26.5800 | Buy Now |
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DISTI #
CY7C1370KV33-200BZXI
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Avnet Americas | SRAM Chip Sync Dual Port 18Mbit 512K X 36Bit/1M X 18Bit 3.3V 165-Pin FBGA Bulk - Trays (Alt: CY7C1370KV33-200BZXI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$29.7640 / $36.1420 | Buy Now |
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Ameya Holding Limited | 68 |
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RFQ | ||
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DISTI #
CY7C1370KV33-200BZXI
|
Avnet Americas | SRAM Chip Sync Dual Port 18Mbit 512K X 36Bit/1M X 18Bit 3.3V 165-Pin FBGA Bulk - Trays (Alt: CY7C1370KV33-200BZXI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$29.7640 / $36.1420 | Buy Now |
Part Details for CY7C1370KV33-200BZXI
CY7C1370KV33-200BZXI CAD Models
CY7C1370KV33-200BZXI Part Data Attributes
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CY7C1370KV33-200BZXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1370KV33-200BZXI
Infineon Technologies AG
ZBT SRAM, 512KX36, 3ns, CMOS, PBGA165, FBGA-165
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 3 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |