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Overview of CY7C1373BV25-117AC by Rochester Electronics LLC
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| R5F117ACGSP#50 | Renesas Electronics Corporation | Microcontrollers Suitable for Applications such as Detectors and Sensors Requiring Low Power and Analog Integration | |
| R5F117ACGSP#30 | Renesas Electronics Corporation | Microcontrollers Suitable for Applications such as Detectors and Sensors Requiring Low Power and Analog Integration | |
| R5F117ACGSP#10 | Renesas Electronics Corporation | Microcontrollers Suitable for Applications such as Detectors and Sensors Requiring Low Power and Analog Integration |
CAD Models for CY7C1373BV25-117AC by Rochester Electronics LLC
Part Data Attributes for CY7C1373BV25-117AC by Rochester Electronics LLC
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
ROCHESTER ELECTRONICS LLC
|
|
Part Package Code
|
QFP
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|
Package Description
|
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
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|
Pin Count
|
100
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|
Reach Compliance Code
|
unknown
|
|
Access Time-Max
|
7.5 ns
|
|
Additional Feature
|
FLOW-THROUGH ARCHITECTURE
|
|
JESD-30 Code
|
R-PQFP-G100
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|
JESD-609 Code
|
e0
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Length
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20 mm
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|
Memory Density
|
18874368 bit
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Memory IC Type
|
ZBT SRAM
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Memory Width
|
18
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Moisture Sensitivity Level
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NOT SPECIFIED
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
100
|
|
Number of Words
|
1048576 words
|
|
Number of Words Code
|
1000000
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Operating Mode
|
SYNCHRONOUS
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|
Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
1MX18
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Package Body Material
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PLASTIC/EPOXY
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|
Package Code
|
LQFP
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Package Shape
|
RECTANGULAR
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|
Package Style
|
FLATPACK, LOW PROFILE
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|
Parallel/Serial
|
PARALLEL
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|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
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|
Qualification Status
|
COMMERCIAL
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|
Seated Height-Max
|
1.6 mm
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Supply Voltage-Max (Vsup)
|
2.625 V
|
|
Supply Voltage-Min (Vsup)
|
2.375 V
|
|
Supply Voltage-Nom (Vsup)
|
2.5 V
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Surface Mount
|
YES
|
|
Temperature Grade
|
COMMERCIAL
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|
Terminal Finish
|
TIN LEAD
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|
Terminal Form
|
GULL WING
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|
Terminal Pitch
|
0.65 mm
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|
Terminal Position
|
QUAD
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Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
14 mm
|