Part Details for CY7C1380KV33-250AXC by Infineon Technologies AG
Overview of CY7C1380KV33-250AXC by Infineon Technologies AG
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Price & Stock for CY7C1380KV33-250AXC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2832-CY7C1380KV33-250AXC-ND
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DigiKey | IC SRAM 18MBIT PAR 100TQFP Min Qty: 25 Lead time: 11 Weeks Container: Tray MARKETPLACE PRODUCT |
524 In Stock |
|
$21.1800 | Buy Now |
DISTI #
448-CY7C1380KV33-250AXC-ND
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DigiKey | IC SRAM 18MBIT PAR 100TQFP Min Qty: 25 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
|
$26.0192 | Buy Now |
DISTI #
CY7C1380KV33-250AX
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Avnet Americas | SRAM Chip Sync Single 3.3V 18M-Bit 512K X 36 2.5ns 100-Pin TQFP Tray (Alt: CY7C1380KV33-250AX) RoHS: Compliant Min Qty: 32 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 524 Partner Stock |
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$19.6788 / $23.8050 | Buy Now |
DISTI #
CY7C1380KV33-250AX
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Avnet Americas | SRAM Chip Sync Single 3.3V 18M-Bit 512K X 36 2.5ns 100-Pin TQFP Tray - Trays (Alt: CY7C1380KV33-250AX) RoHS: Compliant Min Qty: 144 Package Multiple: 72 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$25.4660 / $30.9230 | Buy Now |
DISTI #
V79:2366_28364583
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Arrow Electronics | SRAM Chip Sync Quad 3.3V 18M-bit 512K x 36 2.5ns 100-Pin TQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2031 | Americas - 10 |
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$21.7900 / $25.7600 | Buy Now |
DISTI #
V99:2348_14673764
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Arrow Electronics | SRAM Chip Sync Quad 3.3V 18M-bit 512K x 36 2.5ns 100-Pin TQFP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 11 Weeks Date Code: 1737 | Americas - 3 |
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$1.5090 / $5.9661 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 144 Package Multiple: 144 Container: Tray | 0Tray |
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$22.7400 | Buy Now |
DISTI #
CY7C1380KV33-250AX
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Avnet Americas | SRAM Chip Sync Single 3.3V 18M-Bit 512K X 36 2.5ns 100-Pin TQFP Tray (Alt: CY7C1380KV33-250AX) RoHS: Compliant Min Qty: 32 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 524 Partner Stock |
|
$19.6788 / $23.8050 | Buy Now |
DISTI #
CY7C1380KV33-250AX
|
Avnet Americas | SRAM Chip Sync Single 3.3V 18M-Bit 512K X 36 2.5ns 100-Pin TQFP Tray - Trays (Alt: CY7C1380KV33-250AX) RoHS: Compliant Min Qty: 144 Package Multiple: 72 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$25.4660 / $30.9230 | Buy Now |
DISTI #
SP005638435
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EBV Elektronik | SRAM Chip Sync Single 3.3V 18M-Bit 512K X 36 2.5ns 100-Pin TQFP Tray (Alt: SP005638435) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for CY7C1380KV33-250AXC
CY7C1380KV33-250AXC CAD Models
CY7C1380KV33-250AXC Part Data Attributes:
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CY7C1380KV33-250AXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1380KV33-250AXC
Infineon Technologies AG
Cache SRAM, 512KX36, 2.5ns, CMOS, PQFP100, TQFP-100
|
Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | TQFP-100 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 11 Weeks | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 2.5 ns | |
Additional Feature | PIPE LINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 250 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PQFP-G100 | |
Length | 20 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 100 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX36 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP100,.63X.87 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.6 mm | |
Standby Current-Max | 0.08 A | |
Standby Voltage-Min | 3.135 V | |
Supply Current-Max | 0.2 mA | |
Supply Voltage-Max (Vsup) | 3.63 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Pure Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm |