Part Details for CY7C1381C-100BZI by Cypress Semiconductor
Overview of CY7C1381C-100BZI by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1381C-100BZI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C1381C-100BZI-ND
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DigiKey | IC SRAM 18MBIT PAR 165FBGA Min Qty: 18 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
26 In Stock |
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$17.1300 | Buy Now |
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Rochester Electronics | Standard SRAM, 512KX36, 8.5ns PBGA165 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 26 |
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$14.7000 / $17.2900 | Buy Now |
Part Details for CY7C1381C-100BZI
CY7C1381C-100BZI CAD Models
CY7C1381C-100BZI Part Data Attributes:
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CY7C1381C-100BZI
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C1381C-100BZI
Cypress Semiconductor
Standard SRAM, 512KX36, 8.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 8.5 ns | |
Additional Feature | FLOW-THROUGH ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 100 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.07 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.175 mA | |
Supply Voltage-Max (Vsup) | 3.63 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 13 mm |
Alternate Parts for CY7C1381C-100BZI
This table gives cross-reference parts and alternative options found for CY7C1381C-100BZI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1381C-100BZI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C1381D-100BZXI | Cache SRAM, 512KX36, 8.5ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1381C-100BZI vs CY7C1381D-100BZXI |
CY7C1381D-100BZC | Cache SRAM, 512KX36, 8.5ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1381C-100BZI vs CY7C1381D-100BZC |