Part Details for CY7C1412KV18-333BZXI by Cypress Semiconductor
Overview of CY7C1412KV18-333BZXI by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Computing and Data Storage
Energy and Power Systems
Price & Stock for CY7C1412KV18-333BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
76T3638
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Newark | Sync Srams/Tray |Cypress Infineon Technologies CY7C1412KV18-333BZXI Min Qty: 272 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Rochester Electronics | CY7C1412KV18 - QDR SRAM, 2MX18, 0.45ns PBGA165 RoHS: Compliant Status: Active Min Qty: 1 | 64 |
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$44.3200 / $52.1400 | Buy Now |
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Flip Electronics | Stock, ship today | 1423 |
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$34.3200 | RFQ |
Part Details for CY7C1412KV18-333BZXI
CY7C1412KV18-333BZXI CAD Models
CY7C1412KV18-333BZXI Part Data Attributes:
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CY7C1412KV18-333BZXI
Cypress Semiconductor
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Datasheet
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CY7C1412KV18-333BZXI
Cypress Semiconductor
QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.3 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | BURST ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.28 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.75 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm |