Datasheets
CY7C1413KV18-250BZXC by:

QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165

Part Details for CY7C1413KV18-250BZXC by Infineon Technologies AG

Overview of CY7C1413KV18-250BZXC by Infineon Technologies AG

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for CY7C1413KV18-250BZXC

Part # Distributor Description Stock Price Buy
DISTI # CY7C1413KV18-250BZXC-ND
DigiKey IC SRAM 36MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray 107
In Stock
  • 1 $54.0600
  • 10 $50.1430
  • 25 $48.3520
  • 40 $47.1478
  • 136 $41.3122
$41.3122 / $54.0600 Buy Now
DISTI # 2015-CY7C1413KV18-250BZXC-ND
DigiKey IC SRAM 36MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray 7
In Stock
  • 1 $15.4400
$15.4400 Buy Now
DISTI # CY7C1413KV18-250BZ
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1413KV18-250BZ) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray 0
  • 136 $46.0040
$46.0040 Buy Now
DISTI # 727-C1413KV18250BZXC
Mouser Electronics SRAM 36MB (2Mx18) 1.8v 250MHz QDR II SRAM RoHS: Compliant 0
  • 1 $53.7800
  • 10 $49.8800
  • 25 $47.0400
  • 50 $46.9000
  • 100 $41.1000
$41.1000 / $53.7800 Order Now
DISTI # V79:2366_28364584
Arrow Electronics SRAM Chip Sync Dual 1.8V 36M-bit 2M x 18 0.45ns 165-Pin FBGA Tray Min Qty: 1 Package Multiple: 1 Date Code: 2131 Americas - 110
  • 1 $46.5200
  • 10 $43.9000
  • 25 $42.1300
  • 40 $41.4400
  • 50 $41.0800
  • 100 $38.3400
  • 136 $36.6700
  • 272 $36.1000
$36.1000 / $46.5200 Buy Now
Future Electronics CY7C1413KV18 Series 36 Mb (2M x 18) QDR® II SRAM 4-Word Burst - FBGA-165 RoHS: Compliant pbFree: Yes Min Qty: 136 Package Multiple: 136 Container: Tray 0
Tray
  • 136 $40.1200
$40.1200 Buy Now
DISTI # 70347334
Verical SRAM Chip Sync Dual 1.8V 36M-bit 2M x 18 0.45ns 165-Pin FBGA Tray Min Qty: 1 Package Multiple: 1 Date Code: 2131 Americas - 110
  • 1 $46.5200
  • 10 $43.9000
  • 25 $42.1300
  • 40 $41.4400
  • 50 $41.0800
  • 100 $38.3400
  • 136 $36.6700
  • 272 $36.1000
$36.1000 / $46.5200 Buy Now
DISTI # CY7C1413KV18-250BZ
Avnet Americas SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1413KV18-250BZ) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray 0
  • 136 $46.0040
$46.0040 Buy Now
DISTI # SP005639131
EBV Elektronik SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray (Alt: SP005639131) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 1 Weeks, 5 Days EBV - 0
Buy Now

Part Details for CY7C1413KV18-250BZXC

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CY7C1413KV18-250BZXC Part Data Attributes:

CY7C1413KV18-250BZXC Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
CY7C1413KV18-250BZXC Infineon Technologies AG QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description FBGA-165
Reach Compliance Code compliant
Factory Lead Time 11 Weeks
Samacsys Manufacturer Infineon
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 250 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.26 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.47 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm

Alternate Parts for CY7C1413KV18-250BZXC

This table gives cross-reference parts and alternative options found for CY7C1413KV18-250BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1413KV18-250BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1413KV18-250BZC QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165 Infineon Technologies AG CY7C1413KV18-250BZXC vs CY7C1413KV18-250BZC
Part Number Description Manufacturer Compare
CY7C1413KV18-250BZC QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165 Infineon Technologies AG CY7C1413KV18-250BZXC vs CY7C1413KV18-250BZC

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