Part Details for CY7C1460KV25-167BZXI by Infineon Technologies AG
Overview of CY7C1460KV25-167BZXI by Infineon Technologies AG
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for CY7C1460KV25-167BZXI
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
49Y8278
|
Newark | Sync Srams/Tray Rohs Compliant: Yes |Infineon CY7C1460KV25-167BZXI RoHS: Compliant Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
DISTI #
CY7C1460KV25-167BZ
|
Avnet Americas | SRAM Chip Sync Quad 2.5V 36M-Bit 1M x 36 3.4ns 165-Pin FBGA Tray (Alt: CY7C1460KV25-167BZ) RoHS: Compliant Min Qty: 14 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 120 Partner Stock |
|
$44.7888 / $54.1800 | Buy Now |
DISTI #
CY7C1460KV25-167BZ
|
Avnet Americas | SRAM Chip Sync Quad 2.5V 36M-Bit 1M x 36 3.4ns 165-Pin FBGA Tray - Trays (Alt: CY7C1460KV25-167BZ) RoHS: Compliant Min Qty: 7 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 105 Partner Stock |
|
$51.3100 / $60.3600 | Buy Now |
DISTI #
CY7C1460KV25-167BZ
|
Avnet Americas | SRAM Chip Sync Quad 2.5V 36M-Bit 1M x 36 3.4ns 165-Pin FBGA Tray - Trays (Alt: CY7C1460KV25-167BZ) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Container: Tray | 0 |
|
RFQ | |
|
Future Electronics | 36Mbit Parallel 167 MHz 3.4 ns SRAM Synchronous SDR Memory IC - FBGA-165 RoHS: Compliant pbFree: Yes Min Qty: 105 Package Multiple: 105 Lead time: 11 Weeks Container: Tray | 0Tray |
|
$57.5900 | Buy Now |
|
Rochester Electronics | CY7C1460KV25 - Sync SRAMs RoHS: Compliant Status: Active Min Qty: 1 | 105 |
|
$51.3100 / $60.3600 | Buy Now |
Part Details for CY7C1460KV25-167BZXI
CY7C1460KV25-167BZXI CAD Models
CY7C1460KV25-167BZXI Part Data Attributes
|
CY7C1460KV25-167BZXI
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY7C1460KV25-167BZXI
Infineon Technologies AG
ZBT SRAM, 1MX36, CMOS, PBGA165, FBGA-165
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15 mm |